Remote Semiconductor Assembly Process Development Engineer

Description:

• Develop and evaluate advanced packaging technologies such as FCCSP and FCBGA for semiconductor back-end processes.
• Focus on high-density, high-heat-dissipation packages for AI/HPC and high-reliability solutions for automotive and IoT applications.
• Responsible for material and process development, assembly process improvement, and production line setup.
• Drive process quality improvements and yield enhancement activities.

Requirements:

• Minimum 5 years of experience in semiconductor back-end processes (assembly and packaging).
• At least 5 years of experience in molding, strip grinding, or package sawing.
• Hands-on experience in process improvement, quality control, and equipment implementation.
• Bachelor’s degree in Mechanical Engineering, Materials Science, Electronics, Chemistry, or related field.
• Business-level proficiency in Japanese and approximately TOEIC 700 level in English.

Benefits:

• Opportunities for career advancement and diverse experiences across various departments.
• Engage in impactful work developing innovative products and solutions.
• Flexible work environment with remote work options and a focus on employee well-being.